The ability to study the interior of an object without destroying it is an important industrial tool. One method of recent interest is steady-state thermal or impedance imaging. In this paper we will use the steady-state heat equation to locate one or more circular inclusions within a two-dimensional region, where the boundaries of the inclusions have partially disbonded from the surrounding material; this disbond is modelled as between the heat flux and jump discontinuity at the disbonded interface.
Talbott, Shannon and Spring, Hilary, "Thermal Imaging of Circular Inclusions within a Two-Dimensional Region" (2005). Mathematical Sciences Technical Reports (MSTR). 51.