Plane-Pair PEEC Models for PDN Using Sub-Meshing

Authors

Edward Wheeler, Rose-Hulman Institute of TechnologyFollow
L. Wei
K. Shringarpure
A. Reuhli
J. DrewniakFollow

Document Type

Article

Publication Date

2014

DOI Number / ISBN

10.1109/EPEPS.2014.7103622

External Access URL

http://dx.doi.org/10.1109/EPEPS.2014.7103622

Recommended Citation

Wei, L., Shringarpure, K., Reuhli, A., Wheeler, E., & Drewniak, J. (2014, October). Plane-pair PEEC models for PDN using sub-meshing [Conference presentation]. 2014 IEEE Conference on Electrical Performance of Electronic Packaging and Systems, Portland, OR. https://doi.org/10.1109/EPEPS.2014.7103622